Resistor datasheet


Resistor , 250mW 82K. Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. GENERAL PURPOSE CHIP RESISTORS.

Supersedes Date of Mar. A homogeneous film of metal alloy is deposited on a high grade ceramic body.

After a helical groove has been cut in the resistive layer, tinned connecting leads of electrolytic copper are welded to the end-caps. File Name, Size, Upload Date. FOOTPRINT AND SOLDERING. For recommended footprint and soldering profiles, please see the special data sheet “Chip resistors mounting”.

For material declaration information . When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this .

The most economic industrial investment. Excellent long term stability. Termination: Standard solder-plated copper lead. No licence is granted for the use of it other than for information purposes in connection with the products to which . Performance Characteristics.

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device.

Small, thin and lightweight. Applicable Both flow and reflow soldering. Products with lead-free terminations meet. EU RoHS regulation is not intended for Pb-glass contained in electrode, resistor element and glass. Interlink Electronics FSRTM 4series is part of the single zone.

This force sensitivity is optimized for use in human . Temperature coefficient of resistance (TCR). C typical (see Table 2). Power rating (at 70°C):.

The ceramic substrate is bonded to a copper heat sink which becomes the metal mounting surface. This assembly is molded with the copper heat sink flush with the back . The resistors are constructed in a high grade ceramic body ( aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance .


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